MECH-EL / MEI 829
The Mech-El/MEI 829 is designed for thermosonic and thermocompression ball bonding of IC's, hybrids, microwave, laser diodes, and other devices using gold wire from 0.7 mil to 3 mil in size.
SPECIFICATIONS:
| Bonding Processes: | Thermocompression or thermosonic ball bonding using gold wire. |
| Wire sizes: | 1 mil (25 micron) wire standard. 0.7 mil (18 micron), 2 mil (51 micron), and 3 mil (76 micron) capability available. |
| Tip Weight: | 15 - 150 grams. |
| Capillary size: | 0.063" x 0.375" (1.6mm x 9.5 mm) standard. |
| Heated Workstage: | Digital heat control option will regulate temperature from ambient to 300°C +/- 0.5% (dependant upon application). |
| Ultrasonics: | Uthe 10G generator with 25ST transducer standard. |
| Micropositioner: | 6:1 standard. |
| Services: | Electrical: 110-115 VAC, 50/60Hz, 5 amps or 220-240 VAC, 50/60Hz, 2.5 amps. Air: 40 PSI (240 kPa) minimum, if required. Vacuum: 20" (510 mm) Hg minimum, if required. |
| Dimensions: | Length: Width: 18" (45.7cm) Height 17.75" (45.1cm) Net Weight: 45 pounds |
*Note: Exact dimensions are dependent upon the options on the machine.